AI Infrastructure Boom Drives $2.5-3B Packaging Investments as Memory Shortages Reshape Chip Markets
Amkor Technology is investing $2.5-3 billion in advanced packaging capacity as AI data centers create unprecedented demand for DRAM and high-bandwidth memory (HBM). The AI-driven memory super-cycle differs from traditional boom-bust patterns, with structural data center demand creating persistent supply tightness across FPGAs, photonics, and timing solutions. Nine companies reported sustained growth despite manufacturer caution following 2023's recovery.








